Also, the refrigerant is flowing in the refrigerant flow path 31 of the mounting section 30. The heat of the electronic device 500 is uniformly absorbed from the electronic device 500 to the mounting section 30, as illustrated by a white arrow C in FIG. 3. As a result, the temperature of the electronic device 500 to be inspected can be lowered. It should be noted that the control device 19 may feedback-control the light amounts of the respective LED arrays 400 based on detection values of a plurality of temperature sensors (not illustrated) provided on the stage 11. For example, the control device may feedback-control the light amounts of the respective LED arrays 400 based on detection values of a plurality of temperature sensors (not illustrated) provided on the stage 11.

Also, the control device 19 obtains, from the tester 14, information of power (power information) supplied from the tester 14 to the electronic device 500. The control device 19 may be configured to detect heat generation of the electronic device 500 based on the obtained information.

Since the inspection apparatus 10 can control the lighting and the light amounts of the LEDs 41 for the respective LED arrays 400, the heating zone can be limited, and the inspection apparatus 10 can cope with a sudden heat generation of the electronic device 500. On the other hand, since the uniformity in the temperature of the entire wafer W decreases, one or more correction values for correcting a control command are obtained in order to achieve uniformity in the temperature of the electronic device 500.