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Control method of inspection apparatus and inspection apparatus

專利號(hào)
US12075537B2
公開日期
2024-08-27
申請(qǐng)人
Tokyo Electron Limited(JP Tokyo)
發(fā)明人
Hiroaki Agawa
IPC分類
G01R31/28; H05B45/12; H05B45/40
技術(shù)領(lǐng)域
led,arrays,correction,correctors,wafer,c12,inspection,twelve,thermal,401a
地域: Tokyo

摘要

A control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

說明書

On the other hand, the temperature distribution illustrated in FIG. 5B is a temperature distribution in a case in which the outputs of the surrounding ten LED arrays 400 are larger than the outputs of the two LED arrays 400 overlapping the electronic device 500. In this case, as illustrated in FIG. 5B, temperature within the presence area 401A of the two LED arrays 400 overlapping the electronic device 500 can be equalized, with a relatively small temperature difference T2 between the temperature at the center and the temperature at the boundary of the presence area 401A.

Since it takes a lot of time and effort to manually adjust the output of the LED arrays 400, the control device 19 of the inspection apparatus 10 includes one or more correctors capable of correcting the output of each LED array 400. FIG. 6 is a diagram illustrating an example of a control system that feedback-controls the light amount of each LED array 400 of the inspection apparatus 10. FIG. 6 illustrates the control device 19, the LED arrays 400, and the mounting section 30 of the inspection apparatus 10. The mounting section 30 is a chuck and includes a plurality of temperature sensors 32. The temperature sensors 32 may be of any configuration as it can detect the temperature of the wafer W mounted on the upper surface of the mounting section 30, and a thermoelectric pair or the like can be used as an example.

權(quán)利要求

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