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Control method of inspection apparatus and inspection apparatus

專利號
US12075537B2
公開日期
2024-08-27
申請人
Tokyo Electron Limited（JP Tokyo）
發(fā)明人
Hiroaki Agawa
IPC分類
G01R31/28; H05B45/12; H05B45/40
技術(shù)領域
led,arrays,correction,correctors,wafer,c12,inspection,twelve,thermal,401a
地域： Tokyo

摘要

A control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

說明書

According to one aspect of the present disclosure, a control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

According to one aspect, it is possible to correct a control command so as to evenly heat an inspection object to be inspected.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating a configuration of an inspection apparatus according to the present embodiment;

FIG. 2 is an example of a cross-sectional view illustrating a temperature adjustment mechanism of a wafer in the inspection apparatus according to the present embodiment;

FIG. 3 is an example of a cross-sectional view illustrating an operation of a temperature adjustment mechanism at the time of inspection;

FIG. 4 is an example of a plan view illustrating an example of LED sections at the time of inspection;

權(quán)利要求

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