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Control method of inspection apparatus and inspection apparatus

專利號(hào)
US12075537B2
公開日期
2024-08-27
申請(qǐng)人
Tokyo Electron Limited(JP Tokyo)
發(fā)明人
Hiroaki Agawa
IPC分類
G01R31/28; H05B45/12; H05B45/40
技術(shù)領(lǐng)域
led,arrays,correction,correctors,wafer,c12,inspection,twelve,thermal,401a
地域: Tokyo

摘要

A control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

說明書

Accordingly, it is possible to provide the inspection apparatus 10 and the control method of the inspection apparatus 10 that enable to correct a control command so as to evenly heat the electronic device 500 that is an inspection object to be inspected.

In addition, since the first thermal images are obtained by the IR camera 200, the first temperature distributions can be easily obtained and the step of obtaining the correction values C1 to C12 can be simplified.

In addition, since the second thermal image is generated by taking the sum of the temperatures of each pixel of the twelve first thermal images obtained for the area 401, and the second temperature distribution represented by the second thermal image is obtained, the second temperature distribution can be accurately and efficiently obtained even when the number of LED arrays 400 is large.

Also, when obtaining the second temperature distribution, the second thermal image is generated by taking the sum of the temperatures of each pixel in the presence area 401A out of the pixels of the twelve first thermal images obtained for the area 401, and the second temperature distribution represented by the second thermal image is obtained. Therefore, the second temperature distribution can be more efficiently obtained.

權(quán)利要求

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