The loader 13 takes out the wafer W on which the electronic devices are arranged from a FOUP (not illustrated) that is a transportation container to mount the wafer W on the stage 11 inside the chamber 12, and removes the inspected wafer W from the stage 11 to house the wafer W in the FOUP.

The probe card 15 is connected to the tester 14 via an interface 17. Also, when the respective probes 16 contact the electrode pads or solder bumps provided corresponding to the electrodes of the respective electronic devices of the wafer W, the respective probes 16 supply electric power from the tester 14 to the electronic devices via the interface 17 or transmit signals from the electronic devices via the interface 17 to the tester 14.

The tester 14 includes a test board (not illustrated) that reproduces a part of a circuit configuration of a motherboard on which an electronic device is mounted, and the test board is connected to a tester computer 18 that determines whether the electronic device is good or bad based on signals from the electronic device. The tester 14 can reproduce the circuit configurations of a plurality of types motherboards by replacing the test board.