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Control method of inspection apparatus and inspection apparatus

專利號(hào)
US12075537B2
公開日期
2024-08-27
申請(qǐng)人
Tokyo Electron Limited(JP Tokyo)
發(fā)明人
Hiroaki Agawa
IPC分類
G01R31/28; H05B45/12; H05B45/40
技術(shù)領(lǐng)域
led,arrays,correction,correctors,wafer,c12,inspection,twelve,thermal,401a
地域: Tokyo

摘要

A control method of an inspection apparatus including a stage on which a substrate having an inspection object to be inspected is mounted and a plurality of light sources configured to emit light to heat the substrate includes: individually lighting the plurality of light sources and obtaining a plurality of first temperature distributions of the substrate; obtaining a second temperature distribution representing a sum of the plurality of first temperature distributions; obtaining one or more correction values for correcting an amount of light output from at least one or more light sources of the plurality of light sources based on the second temperature distribution; and correcting the amount of light output from each of the at least one or more light sources using the one or more correction values.

說明書

A control device 19 controls the operation of the stage 11. The control device 19 controls the movement mechanism (not illustrated) of the stage 11 to move the stage 11 in the horizontal direction and in the vertical direction. Also, the control device 19 is connected to the stage 11 by wiring 20. The control device 19 controls the operation of a light emission mechanism 40, which will be described later below, through the wiring 20. Further, the control device 19 is communicably connected to the tester 14, and information of the tester 14 is input to the control device 19.

A refrigerant supply device 21 is connected to a refrigerant flow path 31 of the stage 11 via a forward pipe 22 and a return pipe 23, and can circulate a refrigerant between the refrigerant supply device 21 and the refrigerant flow path 31 of the stage 11. The control device 19 controls the refrigerant supply device 21 to control the temperature, the flow rate, and the like of the refrigerant supplied from the refrigerant supply device 21 to the refrigerant flow path 31.

It should be noted that the control device 19 and the refrigerant supply device 21 are illustrated as being provided in the loader 13. However, the present disclosure is not limited thereto, and the control device 19 and the refrigerant supply device 21 may be provided at other positions.

權(quán)利要求

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