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Circuit board, semiconductor device, power converter, and moving object

專利號(hào)
US12075556B2
公開日期
2024-08-27
申請(qǐng)人
Mitsubishi Electric Corporation（JP Tokyo）
發(fā)明人
Yuta Fukushima
IPC分類
H05K1/00; H05K1/02
技術(shù)領(lǐng)域
board,circuit,electronic,component,indicating,heat,resin,visually,power,generates
地域： Tokyo

摘要

The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature.

說明書

TECHNICAL FIELD

The present invention relates to a circuit board. Furthermore, the present invention relates to a semiconductor device, a power converter, and a moving object each including the circuit board.

BACKGROUND ART

A circuit board often includes a printed circuit board and a plurality of electronic components. The plurality of electronic components are mounted on the printed circuit board.

Applying, to an object, a material which visually changes upon increase in the temperature for visually checking the temperature of the object has been proposed.

For example, according to the technology described in Patent Document 1, a composition is placed proximately to a surface for indicating whether a temperature of the surface exceeds a threshold temperature (lines 12 to 14 of a lower right column in page 194). If the temperature of the surface is above the threshold temperature, the composition is transparent; if the temperature of the surface is below the threshold temperature, the composition is opaque (lines 14 to 16 of the lower right column in page 194). The composition includes a transparent, flexible matrix material, and an indicating material dispersed within the matrix material (lines 1 to 3 of an upper right column in page 195). The indicating material is particulate (lines 7 to 8 of an upper left column in page 196). The indicating material can be wax (lines 5 to 6 of an upper right column in page 196).

Furthermore, coating a circuit board for improving, for example, insulation and moisture resistance of the circuit board has been proposed.

權(quán)利要求

1
The invention claimed is:1. A circuit board, comprising:a printed circuit board;a first electronic component mounted on the printed circuit board;a second electronic component mounted on the printed circuit board; anda temperature indicating resin that comes in contact with the first electronic component, the temperature indicating resin visually changing upon increase in a temperature, whereina temperature indicating resin that comes in contact with the second electronic component does not exist,the first electronic component is an electronic component that does not generate heat in a normal operation,the second electronic component is an electronic component that generates heat in a normal operation, andthe temperature indicating resin includes:a resin;wax embedded in the resin andthe wax is plate-shaped wax.2. The circuit board according to claim 1,wherein the first electronic component is a passive component.3. A circuit board, comprising:a printed circuit board;a first electronic component mounted on the printed circuit board;a second electronic component mounted on the printed circuit board; anda temperature indicating resin that comes in contact with the first electronic component, the temperature indicating resin visually changing upon increase in a temperature, whereina temperature indicating resin that comes in contact with the second electronic component does not exist,the first electronic component is an electronic component that does not generate heat in a normal operation,the second electronic component is an electronic component that generates heat in a normal operation,the temperature indicating resin includes:a resin;wax embedded in the resin andthe wax is flake wax.4. A semiconductor device, comprising:a circuit board including:a printed circuit board;a first electronic component mounted on the printed circuit board;a second electronic component mounted on the printed circuit board; anda temperature indicating resin that comes in contact with the first electronic component, the temperature indicating resin visually changing upon increase in a temperature; anda sheath including an opening facing the temperature indicating resin, whereina temperature indicating resin that comes in contact with the second electronic component does not exist,the first electronic component is an electronic component that does not generate heat in a normal operation,the second electronic component is an electronic component that generates heat in a normal operation.5. A semiconductor device, comprising:the circuit board according to claim 1; anda semiconductor element including a wide bandgap semiconductor.6. A power converter, comprising:a main conversion circuit including a semiconductor device, the main conversion circuit converting an input power to output a resulting power;a driving circuit outputting, to the semiconductor device, a driving signal for driving the semiconductor device; anda control circuit outputting, to the driving circuit, a control signal for controlling the driving circuit,wherein at least one of the main conversion circuit, the driving circuit, and the control circuit includes the circuit board according to claim 1.7. A moving object comprising the power converter according to claim 6.
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