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Circuit board, semiconductor device, power converter, and moving object

專利號
US12075556B2
公開日期
2024-08-27
申請人
Mitsubishi Electric Corporation（JP Tokyo）
發(fā)明人
Yuta Fukushima
IPC分類
H05K1/00; H05K1/02
技術(shù)領(lǐng)域
board,circuit,electronic,component,indicating,heat,resin,visually,power,generates
地域： Tokyo

摘要

The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature.

說明書

權(quán)利要求

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