The power line 2062 includes an extension or arm 2066 that couples to the electrode 2036. The electrode 2036 couples to the electrode 2028 with a via 2068. While the electrode 2038 is formed, the first and second select lines 2054, 2056 are formed on the second dielectric layer 2034. Openings are formed in the second dielectric layer 2034 as locations to couple to the semiconductor electrode 2036. A first contact electrode 2070 and a second contact electrode 2072 are formed at the same time, with the same deposition, patterning, and etching steps as the electrode 2038. The first and second contact electrodes are between the third dielectric layer and the second dielectric layer. Openings in the third dielectric layer are formed and the arms or extensions 2050 and 2066 are coupled to the first and second contact electrodes through vias 2052 and 2076. The second electrode 2044 extends substantially parallel to the data and power lines 2060, 2063. The second electrode 2044 extends past the first and second select lines.