Circuits including non-linear components for electronic devices
摘要
說明書
A third dielectric 2346 is formed on the channel conductor and the second dielectric. A first interconnect 2328 is formed on the third dielectric 2346 and in an opening that exposes the channel conductor. The first interconnect is coupled to the pixel capacitor 2302 with an L-shaped top down arrangement. A second interconnect 2324 is formed on the third dielectric and in an opening that exposes another portion of the channel conductor. The second interconnect is conformally formed across the pixel cell and is coupled to the data line 2332 after passing over the data line 2334. The first and second interconnects are spaced from each other by a third dimension 2314 in the first direction. The third dimension is less than the first dimension.
