Intelligent in-rack pump or compressor unit for datacenter cooling systems
摘要
說明書
In at least one embodiment, when temperature at a hot aisle of a rack, at a vicinity of a computing device, or of a fluid (secondary coolant or local coolant) is determined to be beyond a threshold (implying that more heat is being generated by an associated computing device than can be handled by forced air alone), a second mode for a datacenter cooling system may be enabled to use a secondary cooling loop with or without a heat exchanger. In at least one embodiment, a second mode engages or enables a secondary cooling loop in addition to a first mode already provided to cool at least one computing device via a heat exchanger 364 having two-phase fluid circulating from a cold plate associated with at least one computing device to provide further cooling than provided by a secondary cooling loop. In at least one embodiment, a control unit 362 may be enabled to provide signals for flow diverter type flow controllers 310C, 312C and other flow controllers 368 to engage or enable a secondary cooling loop and/or a pump or compressor unit 362A therein.
In at least one embodiment, a heat exchanger is interfaced or associated with at least one cold plate to absorb heat from at least one computing device using a two-phase fluid. In at least one embodiment, a heat exchanger 364 is further interfaced or associated with a pump or compressor unit 362A. In at least one embodiment, a pump or compressor unit 362A can cause dissipation of at least part of a heat from a two-phase fluid to an area within a datacenter, such as above racks of a datacenter or to a hot aisle of a datacenter. In at least one embodiment, a pump or compressor unit include a pump or a compressor and associated flow controllers (such as valves) and lines prior to association or interfacing with coils or plates of a heat exchanger.
