Semiconductor device
地域：
Tokyo
摘要
A semiconductor device includes a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers, a semiconductor film extending in the first direction through the conductive layers, an insulating film around the semiconductor film between the semiconductor film and the plurality of conductive layers. During a program operation performed on a first memory cell, a program voltage is applied to the first conductive layer while a first voltage is applied to the second conductive layers and a second voltage different from the first voltage is applied to the third conductive layers. The second conductive layers are each connected to gates of second memory cells programmed to store m bits, and the third conductive layers are each connected to gates of third memory cells programmed to store n bits, where n is different from m.
說(shuō)明書(shū)
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This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2022-043864 filed Mar. 18, 2022, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a semiconductor device.
A semiconductor device having a three-dimensional structure is known in which a semiconductor film extends in a stacking direction in a stack in which a plurality of conductive layers is stacked via an insulating layer, and a portion close to each conductive layer and the semiconductor film functions as a memory cell. In such a semiconductor device, it is desirable to improve the operation reliability.
權(quán)利要求
What is claimed is:1. A semiconductor device comprising:a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers; a first semiconductor film extending in the first direction through the plurality of conductive layers; and a first insulating film around the first semiconductor film between the first semiconductor film and the plurality of conductive layers, wherein during a program operation performed on a first memory cell disposed at a first position where the first conductive layer intersects the first semiconductor film, a program voltage is applied to the first conductive layer while a first voltage is applied to the second conductive layers and a second voltage different from the first voltage is applied to the third conductive layers, and the second conductive layers are each connected to gates of second memory cells, each of which has been programmed to store m bits of data, and the third conductive layers are each connected to gates of third memory cells, each of which has been programmed to store n bits of data, where n is different from m. 2. The semiconductor device according to claim 1 , wherein n is greater than m and the first voltage is higher than the second voltage. 3. The semiconductor device according to claim 1 , wherein the first conductive layer is adjacent to and between two of the second conductive layers, each of which is adjacent to a different one of the third conductive layers. 4. The semiconductor device according to claim 1 , wherein the first conductive layer is adjacent to and between a first group of two adjacent second conductive layers and a second group of two adjacent second conductive layers. 5. The semiconductor device according to claim 4 , wherein each of the first and second groups of two adjacent second conductive layers is adjacent to and between the first conductive layer and a different one of the third conductive layers. 6. The semiconductor device according to claim 1 , the first conductive layer is adjacent to and between a first group of at least three adjacent second conductive layers and a second group of at least three adjacent second conductive layers. 7. The semiconductor device according to claim 1 , whereina spacing between adjacent conductive layers in the plurality of conductive layers is not uniform and alternates between a first spacing and a second spacing. 8. The semiconductor device according to claim 7 , whereinn is greater than m and the first spacing is smaller than the second spacing, and two of the adjacent conductive layers having the first spacing includes one of the second conductive layers which is below the first spacing. 9. The semiconductor device according to claim 7 , whereinn is greater than m and the first spacing is smaller than the second spacing, and two of the adjacent conductive layers having the second spacing includes one of the second conductive layers which is below the first spacing. 10. A semiconductor device comprising:a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers; a first semiconductor film extending in the first direction through the plurality of conductive layers; and a first insulating film around the first semiconductor film between the first semiconductor film and the plurality of conductive layers, wherein during a program operation performed on a first memory cell disposed at a first position where the first conductive layer intersects the first semiconductor film, a program voltage is applied to the first conductive layer while a first voltage is applied to the second conductive layers and a second voltage different from the first voltage is applied to the third conductive layers, and the second conductive layers are each connected to gates of second memory cells, each of which has been programmed to store m bits of data, and to gates of third memory cells, each of which has been programmed to store n bits of data, and the third conductive layers are each connected to gates of fourth memory cells, each of which has been programmed to store m bits of data, and to gates of fifth memory cells, each of which has been programmed to store n bits of data, where n is different from m. 11. The semiconductor device according to claim 10 , further comprising:a second semiconductor film extending in the first direction through the plurality of conductive layers; and a second insulating film around the second semiconductor film between the second semiconductor film and the plurality of conductive layers, wherein one of the second conductive layers is connected to a gate of one of the second memory cells disposed at a second position along the first semiconductor film and a gate of one of the third memory cells disposed at a third position along the second semiconductor film, and one of the third conductive layers is connected to a gate of one of the fourth memory cells disposed at a fourth position along the first semiconductor film and a gate of one of the fifth memory cells disposed at a fifth position along the second semiconductor film. 12. The semiconductor device according to claim 10 , further comprising:a substrate above which the plurality of conductive layers are stacked, wherein the second and third memory cells are alternately disposed at positions along the first semiconductor film, and the fourth and fifth memory cells are alternately disposed at positions along the second semiconductor film, and each of the second memory cells has a corresponding fifth memory cell, which is at a same height above the substrate, and each of the third memory cells has a corresponding fourth memory cell, which is at a same height above the substrate. 13. The semiconductor device according to claim 10 , wherein n is greater than m and the first voltage is higher than the second voltage. 14. A method of performing a programming operation in a semiconductor device that includes a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers, a first semiconductor film extending in the first direction through the plurality of conductive layers, and a first insulating film around the first semiconductor film between the first semiconductor film and the plurality of conductive layers, said method comprising:during a program operation performed on a first memory cell disposed at a first position where the first conductive layer intersects the first semiconductor film, applying a program voltage to the first conductive layer while applying a first voltage to the second conductive layers and a second voltage different from the first voltage to the third conductive layers, wherein the second conductive layers are each connected to gates of second memory cells, each of which has been programmed to store m bits of data, and the third conductive layers are each connected to gates of third memory cells, each of which has been programmed to store n bits of data, where n is different from m. 15. The method of claim 14 , wherein n is greater than m and the first voltage is higher than the second voltage. 16. The method of claim 15 , whereina spacing between adjacent conductive layers in the plurality of conductive layers is not uniform and alternates between a first spacing and a second spacing. 17. The method of claim 16 , whereinthe first spacing is smaller than the second spacing, and two of the adjacent conductive layers having the first spacing includes one of the second conductive layers which is below the first spacing and are connected to the gates of the second memory cells which have already been programmed. 18. The method of claim 17 , whereintwo of the adjacent conductive layers having the first spacing includes one of the conductive layers which is above the first spacing and are connected to gates of memory cells which have not yet been programmed. 19. The method of claim 16 , whereinthe first spacing is smaller than the second spacing, and two of the adjacent conductive layers having the first spacing includes one of the second conductive layers which is above the first spacing and are connected to the gates of the second memory cells which have already been programmed. 20. The method of claim 19 , whereintwo of the adjacent conductive layers having the first spacing includes one of the conductive layers which is below the first spacing and are connected to gates of memory cells which have not yet been programmed.
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