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Semiconductor device

專利號(hào)
US12082387B2
公開日期
2024-09-03
申請(qǐng)人
KIOXIA CORPORATION(JP Tokyo)
發(fā)明人
Yuki Inuzuka
IPC分類
G11C16/10; G11C16/04; H10B43/27
技術(shù)領(lǐng)域
qlc,memory,plc,mt,cell,voltage,word,vpass1,in,mt0
地域: Tokyo

摘要

A semiconductor device includes a plurality of conductive layers stacked above one another in a first direction and including a first conductive layer, second conductive layers, and third conductive layers, a semiconductor film extending in the first direction through the conductive layers, an insulating film around the semiconductor film between the semiconductor film and the plurality of conductive layers. During a program operation performed on a first memory cell, a program voltage is applied to the first conductive layer while a first voltage is applied to the second conductive layers and a second voltage different from the first voltage is applied to the third conductive layers. The second conductive layers are each connected to gates of second memory cells programmed to store m bits, and the third conductive layers are each connected to gates of third memory cells programmed to store n bits, where n is different from m.

說明書

During the period from timings t6 to t7, the selected word line WL transitions from the program voltage VPGM to the reference voltage VSS1, and the non-selected word line WL corresponding to the PLC transitions from the program pass voltage VPASS1 to the reference voltage VSS1, the non-selected word line WL corresponding to the QLC transitions from the program pass voltage VPASS2 to the reference voltage VSS1, and the selected drain side select gate line SGD transitions from the selected voltage VSGD to the reference voltage VSS2. As a result, the program operation to the memory cell MT is completed.

During the period from the timings t1 to t7, the source side select gate line SGS is maintained at the reference voltage VSS3.

Next, the program disturb and the VPASS disturb will be described with reference to FIGS. 2 and 6 to 8. For example, among the bit lines BL0 to BL2 illustrated in FIGS. 2, 6, and 7, the selected voltage VSS4 (e.g., 0 V) is applied to the bit line BL0, and the write-inhibited voltage VINHIBIT (e.g., 2.5 V) is applied to the other bit lines BL1 and BL2. Among the drain side select gate lines SGD0 to SGD3 illustrated in FIG. 2, the selected voltage VSGD (e.g., 2.5 V) is applied to the drain side select gate line SGD0, and the non-selected voltage VSS2 (e.g., 0 V) is applied to the other drain side select gate lines SGD1, SGD2, and SGD3.

權(quán)利要求

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