For example, when the selected memory cell of the selected memory string MS0 performs programming on the memory cell MT4, in the region DR1, the channel semiconductor film 7 of the non-selected memory strings MS1, MS2, and MS3 is boosted as a result of the program pass voltage VPASS1 and the program pass voltage VPASS2 higher than the program pass voltage VPASS1 being applied to memory cells of these non-selected memory strings during the period from the timings t4 to t5 (see FIG. 8). Thus, the channel semiconductor film 7 may be boosted to a higher voltage (i.e., a voltage closer to the program voltage VPGM) than when uniformly boosted to the program pass voltage VPASS1. Therefore, the electric field stress applied to the memory cells MT4 of the non-selected memory strings MS1, MS2, and MS3 may be alleviated during the period from the timings t5 to t6 (see FIG. 8). As a result, the program disturb resistance may be improved as indicated by the dotted circles in FIGS. 6 and 7.