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Semiconductor devices and data storage systems including the same

專利號
US12096637B2
公開日期
2024-09-17
申請人
Samsung Electronics Co., Ltd.（KR Gyeonggi-do）
發(fā)明人
Kohji Kanamori; Shinhwan Kang; Jeehoon Han
IPC分類
H10B43/50; H10B41/10; H10B41/27; H10B41/41; H10B41/50; H10B43/10; H10B43/27; H10B43/40
技術(shù)領(lǐng)域
separation,channel,may,vs3,structures,structure,upper,vertical,vs2,insulating
地域： Suwon-si

摘要

A semiconductor device includes a substrate; a stack structure on the substrate and including an alternating stack of interlayer insulating layers and gate electrodes; first and second separation regions each extending through the stack structure and extending in a first direction; a first upper separation region between the first and second separation regions and extending through a portion of the stack structure; a plurality of channel structures between the first and second separation regions and extending through the stack structure; and a plurality of first vertical structures each extending through a particular one of the first and second separation regions. Each of the first and second separation regions has a first width in a second direction that is perpendicular to the first direction. Each first vertical structure has a second width in the second direction, the second width being greater than the first width.

說明書

In some example embodiments, the controller 2002 and the semiconductor chips 2200 may be included in one (1) package. In some example embodiments, the controller 2002 and the semiconductor chips 2200 may be mounted on a separate interposer substrate, different from the main substrate 2001, and the controller 2002 and the semiconductor chips 2200 may be connected to each other by a wiring formed on the interposer substrate.

FIG. 14 is a cross-sectional view schematically illustrating a semiconductor package according to some example embodiments. FIG. 14 illustrates some example embodiments of the semiconductor package 2003 of FIG. 13, and conceptually illustrates a region taken along line III-III′ of the semiconductor package 2003 of FIG. 13.

權(quán)利要求

1
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