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Electromagnetic interference shields having attentuation interfaces

專利號
US12133322B2
公開日期
2024-10-29
申請人
Intel Corporation（US CA Santa Clara）
發(fā)明人
Jaejin Lee; Isaac Simpson; Dong-Ho Han; Jose Salazar Delgado; Arturo Navarro Alvarez
IPC分類
H05K1/02
技術領域
emi,shield,perimeter,board,absorber,outer,fence,in,circuit,inner
地域： CA CA Santa Clara

摘要

Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.

說明書

FIELD OF THE DISCLOSURE

This disclosure relates generally to shielding and, more particularly, to electromagnetic interference shields having attenuation interfaces.

BACKGROUND

Electromagnetic interference (EMI) can be emitted from electrical components mounted to a printed circuit board (PCB). The EMI can adversely affect operation of other electrical components. For example, a graphics processing unit (GPU) operating on a PCB can emit a significant amount of noise radiation, thereby causing malfunction or diminished performance of other electrical components. To mitigate effects of EMI, some known PCB implementations employ shields or EMI absorber blocks.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates portions of an example computing device with an example attenuation interface in accordance with teachings of this disclosure.

FIG. 2 is a detailed view of the example attenuation interface of FIG. 1

FIGS. 3A and 3B are detailed views of the example attenuation interface of FIGS. 1 and 2.

FIGS. 4A and 4B are cross-sectional views of an example implementation in accordance with examples disclosed herein.

FIGS. 5A-5E depict another example implementation in accordance with examples disclosed herein.

權利要求

1
What is claimed is:1. An electromagnetic interference (EMI) shield comprising:side walls having respective recesses at distal ends of the side walls, the side walls having a first thickness; andan attenuation interface at the distal ends of the side walls, the attenuation interface including:an EMI absorber in the recesses; anda metal backing adjacent the EMI absorber, the metal backing having second thickness less than the first thickness, the EMI absorber and the metal backing to contact a circuit board.2. The EMI shield as defined in claim 1, wherein the metal backing is a shield fence coupled to the side walls.3. The EMI shield as defined in claim 1, wherein the EMI absorber includes a compressible elastomer with embedded metal flakes.4. The EMI shield as defined in claim 1, wherein the EMI shield is electrically isolated from the circuit board.5. The EMI shield as defined in claim 1, wherein the metal backing includes a flange or snap to couple to the side walls or the circuit board.6. The EMI shield as defined in claim 1, wherein the metal backing is integral with the side walls.7. The EMI shield as defined in claim 6, wherein the EMI absorber and the metal backing extend to a top surface of the EMI shield.8. The EMI shield as defined in claim 7, wherein the EMI absorber and the metal backing define an opening at the top surface of the EMI shield.9. The EMI shield as defined in claim 1, wherein the metal backing surrounds the EMI absorber.10. The EMI shield as defined in claim 9, wherein the metal backing surrounds an entire perimeter of the EMI absorber.11. An attenuation interface to reduce electromagnetic interference (EMI) of a circuit board, the interface comprising:a shield fence at least partially including metal, the shield fence having a side wall, a recess at a distal end of the side wall, a first portion of the side wall having a first thickness and the distal end of the side wall having a second thickness that is less than the first thickness; andan edge gasket having an EMI absorber, the edge gasket in the recess, the edge gasket to contact the shield fence, the shield fence and the edge gasket to contact the circuit board.12. The interface as defined in claim 11, wherein the shield fence and the edge gasket are to extend between a chassis and the circuit board.13. The interface as defined in claim 12, wherein the chassis includes a graphite sheet.14. The interface as defined in claim 11, wherein the edge gasket includes a dovetail-shaped cross-sectional profile to be received by the recess of the shield fence.15. The interface as defined in claim 11, wherein the shield fence is integral with the side wall.16. A method comprising:defining or placing a metal backing at a distal end of a side wall of an EMI shield, the side wall having a first thickness, the metal backing a recess of the EMI shield, the metal backing having a second thickness less than the first thickness, the metal backing corresponding to a recess of the EMI shield; anddefining or placing an EMI absorber in the recess of the EMI shield, the metal backing to surround the EMI absorber, the EMI absorber and the metal backing to be placed in contact with a circuit board.17. The method as defined in claim 16, further including coupling the metal backing and the EMI absorber to the side wall of the EMI shield.18. The method as defined in claim 16, further including coupling the metal backing to the circuit board via a snap fit or a flange.19. The method as defined in claim 16, wherein the defining or placing of the EMI absorber includes assembling a dovetail-shaped recess of the EMI absorber to a complementarily shaped recess of the metal backing.20. The method as defined in claim 16, wherein the distal end is a first distal end, and including placing an opening of the EMI shield to contact a chassis at a second distal end of the side wall of the EMI shield, the second distal end opposite from the first distal end.
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