In a preferred embodiment, the oscillator and microcontroller are collocated on a single printed circuit board. Collocation on a common PCB beneficially permits optimal temperature measurement and control, maximizing frequency stability, frequency reliability, and ability to construct and rely on computational performance models of the circuit to further optimize circuit behavior and performance. Effective frequency control further may require temperature control of critical components in the oscillator circuit. We disclose a method and system for such temperature control that is compatible with personal construction of electronics, including using either through hole or SMD techniques or a combination thereof. In one aspect, a small “oven” is constructed comprising at least one frequency-determining device, at least one temperature measurement device, and at least one heating device. In a preferred embodiment, the temperature-sensing device is a diode junction, such as occurs in a semiconductor diode or other solid-state component, and the heating device is a resistor. The oven is enclosed in an enclosure having poor heat transmissivity. FIG. 10 depicts an exemplary embodiment of an oven 1000, in which insulating enclosure walls 1001 contain an electronic oscillator component 1002 whose temperature is controlled. Resistive heating component 1003 and temperature-sensitive diode-junction sensing component 1004 are housed within the oven 1000. Printed circuit board (PCB) traces 1005 connect the components 1003 and 1004 to a microcontroller/microprocessor (MCU/MPU) unit 1006.