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Interface assembly and method for manufacturing interface assembly

專利號(hào)
US12137523B1
公開(kāi)日期
2024-11-05
申請(qǐng)人
TactoTek Oy（FI Oulunsalo）
發(fā)明人
Mikko Heikkinen; Jarmo S??ski; Ilpo H?nninen; Antti Ker?nen; Tomi Simula; Vinski Br?ysy; P?lvi Apilo; Pasi Korhonen; Topi Wuori
IPC分類
H05K1/02; B29C51/14; G01P1/02; H05K1/18; H05K3/00; H05K3/14; H05K3/30; B29L31/34
技術(shù)領(lǐng)域
movable,multilayer,or,member,substrate,in,sensor,may,structure,be
地域： Oulunsalo

摘要

An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

說(shuō)明書(shū)

Alternatively, the at least one sensor 32 may be one or several magnets and/or ferromagnetic elements, and the sensor arrangement 30 may comprise a magnetometer, such as comprising a magnetometer, such as comprising a coil, or a Hall effect sensor for detecting position or change of position of the one or several magnets.

Still alternatively or in addition, the sensor arrangement 30 may comprise a capacitive sensing element, as a sensor 32, for detecting the position or the change of position of the at least one detection portion 42. In such embodiments, the detection portion 42 may or may not comprise another capacitive element. Alternatively, the movable member 40 may be such as affecting the field measured or monitored by the sensor arrangement 30.

FIG. 4 illustrates an interface assembly 100 with an attachment feature 60. In FIG. 4, the movable member 40 and the functional multilayer structure 20 may be, for example, similar or even identical as illustrated in and described in connection with FIG. 2, although the following applies also to various other embodiments, such as the one or similar as in FIG. 3. There is shown, in FIG. 4, one example of the attachment feature 60. As stated hereinbefore, the attachment feature 60 is, preferably, arranged to provide attachment of movable member 40 relative to the functional multilayer structure 20 in a movable manner.

權(quán)利要求

1
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