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Interface assembly and method for manufacturing interface assembly

專利號(hào)
US12137523B1
公開日期
2024-11-05
申請(qǐng)人
TactoTek Oy（FI Oulunsalo）
發(fā)明人
Mikko Heikkinen; Jarmo S??ski; Ilpo H?nninen; Antti Ker?nen; Tomi Simula; Vinski Br?ysy; P?lvi Apilo; Pasi Korhonen; Topi Wuori
IPC分類
H05K1/02; B29C51/14; G01P1/02; H05K1/18; H05K3/00; H05K3/14; H05K3/30; B29L31/34
技術(shù)領(lǐng)域
movable,multilayer,or,member,substrate,in,sensor,may,structure,be
地域： Oulunsalo

摘要

An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

說明書

Alternatively, the spring 70 may be a planar spring, such as an ortho-planar spring. It may also be of plastic material, such as of a thermoformable plastic film. In case of planar spring, the functional multilayer structure 20 may, for example, comprise a hole, recess, or cavity into which the planar spring can extend when the movable member 40 is being moved towards the structure 20. Alternatively, the planar spring may extend into such hole, recess, or cavity in the movable member 40, or there may be such holes, recesses, or cavities in both of the structure 20 and the movable member 40. Still alternatively, a support frame, such as a support ring or the like, may be utilized for providing space for the planar spring to move.

The spring 70 may, when being compressed, slide on the surface of the structure 20 and the movable member 40. On the other hand, FIG. 13 further illustrates a spring support member 80, such as a pin or the like or a protruding shape, for providing support to the spring 70 in the lateral direction in the figure. The spring support member 80 or members 80 may be arranged to the structure 20 or the movable member 40, depending on the embodiment, so that they align with the grooves or holes or other counter elements in the spring 70. Preferably, the support member(s) 80 may provide support for the spring 70 so that when the spring 70 is being compressed, it will become in contact with the support member 80 in a perpendicular direction relative to the movement direction of the movable member 40.

權(quán)利要求

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