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Interface assembly and method for manufacturing interface assembly

專利號(hào)
US12137523B1
公開日期
2024-11-05
申請(qǐng)人
TactoTek Oy(FI Oulunsalo)
發(fā)明人
Mikko Heikkinen; Jarmo S??ski; Ilpo H?nninen; Antti Ker?nen; Tomi Simula; Vinski Br?ysy; P?lvi Apilo; Pasi Korhonen; Topi Wuori
IPC分類
H05K1/02; B29C51/14; G01P1/02; H05K1/18; H05K3/00; H05K3/14; H05K3/30; B29L31/34
技術(shù)領(lǐng)域
movable,multilayer,or,member,substrate,in,sensor,may,structure,be
地域: Oulunsalo

摘要

An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

說明書

In various embodiments, possible additional layers or generally features, may have been added into the multilayer structure 20 by molding, lamination or suitable coating (e.g. deposition) procedure not forgetting other possible positioning or fixing techniques. The layers may be of protective, indicative and/or aesthetic value (graphics, colors, figures, text, numeric data, etc.) and contain e.g. textile, leather or rubber materials instead of or in addition to further plastics. Additional elements such as electronics, modules, module internals or parts, and/or optics may be installed and fixed e.g. at the outer surface(s) of the structure, such as the exterior surface of an included film or a molded material layer depending on the embodiment. Necessary material shaping/cutting may take place. For example, a diffuser may be produced from locally lasering lightguide material. If provided with a connector, the connector of the multilayer structure 20 may be connected to a desired external connecting element such as an external connector of an external device, system or structure, e.g. a host device. For example, these two connectors may together form a plug-and-socket type connection and interface. The multilayer structure 20 may also be generally positioned and attached herein to a larger ensemble such as an electronic device such as a personal communications device, computer, household apparatus, industrial device, or e.g. a vehicle in embodiments wherein the multilayer structure establishes a part of vehicle exterior or interior, such as a dashboard.

權(quán)利要求

1
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