Embedded circuit board and manufacturing method thereof
地域：
Huai an
摘要
An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
說明書
The subject matter relates to circuit board and manufacturing method thereof, in particular to embedded circuit board and manufacturing method thereof.
In electronic products today, lightness, thinness, and smallness are the desirable features. The circuit board is the main component of the electronic product, and occupies most of space inside the electronic product. The volume of the circuit board largely determines the size of the electronic product. Large circuit boards are not suitable for light, thin, short, and small electronic products. For miniaturization, electronic components are embedded inside the circuit board, the connection path between the components is thus shortened, and transmission losses are reduced. The embedded circuit board allows for increased miniaturization.
However, in the current embedding process, the colloid material flows to fill gaps around and beneath each element. However, the element itself and the pads at both ends can act as blockages to the flow of colloid, so residual gas is compressed at the bottom of the element and is not forced out. As the bonding process progresses, the gas is finally squeezed and distributed at the bottom of the component and the edge of the pad. Then, air bubbles are formed inside the embedded circuit board, negatively affecting the quality of the embedded circuit board. Even by changing the glue content of the prepreg (or film) to improve the fluidity of the colloid, and optimizing the circuit pattern design, it is difficult to avoid bubble formation inside the embedded circuit board.
How to solve the above problems is what those skilled in the art need to consider.
權(quán)利要求
What is claimed is:1. A manufacturing method of embedded a circuit board, comprising: providing an inner layer conductive component, wherein the inner layer conductive component comprises a core board, an insulating substrate, and an inner layer conductive circuit, the insulating substrate and the inner layer conductive circuit are sequentially stacked and arranged on two sides of the core board, a first slot is formed on the inner layer conductive component, the first slot completely penetrates the inner layer conductive component; providing a first insulating layer, a second insulating layer, a first conductive material layer, and a second conductive material layer, wherein a second slot is formed in the first insulating layer, making a position of the first slot correspond to a position of the second slot, the second insulating layer is arranged on a side of the inner layer conductive component away from the first insulating layer, and the first conductive material layer is arranged on the first insulating layer away from the inner layer conductive component on a side of a conductive assembly, the second conductive material layer is arranged on a side of the second insulating layer away from an inner conductive assembly; pressing the first insulating layer, the second insulating layer, the first conductive material layer, the second conductive material layer, and the inner layer conductive component to form a first groove; processing the first conductive material layer to obtain a first conductive circuit, processing the second conductive material layer to obtain a second conductive circuit, removing a part of the second insulating layer that does not cover by the first conductive circuit and the second conductive circuit to obtain a first opening, thereby obtaining an inner layer assembly; providing an embedded element, and disposing the embedded element in the first groove; and providing a first insulating element and a second insulating element, making the first insulating element and the second insulating element cover an outer surface of the inner layer assembly, and cover exposed surfaces on opposite sides of the embedded element, wherein disposing the embedded element in the first groove further comprises: forming a first connection layer on a surface of the first conductive circuit disposed on the first groove by Electroless Nickel/Immersion Gold (ENIG), making the first connection layer electrically connected to the first conductive circuit; disposing a conductive paste on a surface of the first connection layer away from the first conductive circuit to form a second connection layer, making the second connection layer electrically connected to the first connection layer; and putting the embedded element in the first groove, making the embedded element be fixed to the inner layer assembly, and making the embedded element be electrically connected to the second connection layer. 2. The manufacturing method of claim 1 , wherein providing the inner layer conductive component further comprises: providing the core board, wherein the core board comprises a center layer and two center conductive circuits, and the two center conductive circuits are respectively arranged on two sides of the center layer; sequentially laminating an insulating substrate and a conductive layer on each of two sides of the core board; photo-etching the conductive layer to obtain the inner layer conductive circuit; and the first slot is formed through multiple layers of the inner layer conductive circuit and the insulating substrate. 3. The manufacturing method of embedded circuit board of claim 1 , wherein the first insulating layer covers a surface of the inner conductive assembly facing the first groove, the first insulating layer extends from a surface of the inner layer conductive component away from the second insulating layer to the surface of the inner layer conductive component facing the first groove, the first insulating layer is connected to the second insulating layer. 4. The manufacturing method of embedded circuit board of claim 1 , wherein the first insulating element and the second insulating element are formed by pressure buildup, the inner layer assembly comprises a first surface and a second surface disposed opposite to each other, the first groove does not extend to the second surface, the first opening penetrates the second surface and communicates with the first groove, the first insulating element covers the first surface and a surface of the embedded element away from the second surface, the second insulating element covers the second surface and contacts the embedded element through the first opening, the manufacturing method further comprising: forming a first outer layer circuit on a surface of the first insulating element away from the second insulating element; forming a second outer layer circuit on a surface of the second insulating element away from the first insulating element; and forming a solder mask layer on a side of the first outer layer circuit away from the inner layer assembly and a side of the second outer layer circuit away from the inner layer assembly. 5. The manufacturing method of embedded circuit board of claim 2 , wherein each of the two center conductive circuits is provided with at least two pre-cut slits arranged at intervals, the at least two pre-cut slits expose the center layer, projections of the at least two pre-cut slits on the two center conductive circuits disposed on the two sides of the center layer are overlapped in a direction perpendicular to a plane of the center layer. 6. The manufacturing method of embedded circuit board of claim 5 , wherein each of the inner layer conductive circuit is provided with at least two second pre-cut slits arranged at intervals, the at least two second pre-cut slits expose the insulating substrate, in the direction perpendicular to the plane of the center layer, projections of the at least two second pre-cut slits disposed on two inner layer conductive circuits on a side of the insulating substrate away from the center layer are overlapped. 7. The manufacturing method of embedded circuit board of claim 6 , wherein on a plane perpendicular to the plane of the center layer, the projections of the at least two second pre-cut slits provided on the inner layer conductive circuit and the projections of the at least two pre-cut slits provided on the center conductive circuit are overlapped.
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