Organic solar cells and methods of making the same
摘要
說明書
In optional step 227, heat may be applied to the adhesive, the active layer, or both. The depth of penetration and amount of material removed by the adhesive can be dependent on heat applied during the application of the adhesive. In one embodiment, the heat serves to soften or tackify the adhesive. In one embodiment, the heat is applied using convection, forced air, microwave, ultrasonics, irradiation, or any other heating means. In one embodiment, the adhesive is locally heated or globally heated in an oven. In one embodiment, the adhesive is heated first, locally or globally, and laid up or placed on the active layer. In another embodiment, cold adhesive may be laid up or placed on the active layer, or on the photovoltaic device, followed by heating the active layer or photovoltaic device on which is laid the adhesive in an oven at a temperature sufficient to provide adhesion. In one embodiment, the adhesive may be passed under a stream of hot forced air. In one embodiment, the adhesive is heated to a temperature of at least 30° C. In one embodiment, the adhesive is heated to a temperature of at least 40° C. In one embodiment, the adhesive is heated to a temperature of at least 50° C. In one embodiment, the adhesive is heated to a temperature of at least 60° C. In one embodiment, the adhesive is heated to a temperature of at least 70° C. In one embodiment, the adhesive is heated to a temperature of at least 80° C. In one embodiment, the adhesive is heated to a temperature of at least 90° C. In one embodiment, the adhesive is heated to a temperature of at least 100° C.
