The adhesion of an electrode on an OSC device is crucial for reliability, especially for the devices created on flexible substrates. The electrode adhesion was examined for the pristine and the surface PCBM removed blend films created on the basic device structures: Glass/ITO/ZnO/(P3HT:PCBM or single component)/Ag or Glass/ITO/ZnO/(P3HT:PCBM or single component)/V2O5/Ag (