The solder connection portion 11a is provided in such a way as to be located concentrically with the columnar conductor 9a and the columnar conductor 9aa on the ground plane 5d of the multilayer substrate 3, and connects the columnar conductor 9a and the columnar conductor 9aa. The solder connection portion 11b is provided in such a way as to be located concentrically with the columnar conductor 9b and the columnar conductor 9ba on the ground plane 5d of the multilayer substrate 3, and connects the columnar conductor 9b and the columnar conductor 9ba. The solder connection portion 11c is provided in such a way as to be located concentrically with the columnar conductor 9c and the columnar conductor 9ca on the ground plane 5d of the multilayer substrate 3, and connects the columnar conductor 9c and the columnar conductor 9ca.