This application is a continuation of U.S. patent application Ser. No. 17/703,051, entitled “Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals in a Printed Circuit Board”, filed Mar. 24, 2022, which is a continuation of U.S. patent application Ser. No. 17/079,970, entitled “Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals in a Printed Circuit Board”, filed Oct. 26, 2020, which claims priority under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application Ser. No. 63/016,500, entitled “Integrating Graphene Into the Skin Depth Region of High Speed Communications Signals in a Printed Circuit Board”, filed Apr. 28, 2020, the disclosures of which are incorporated herein by reference their entireties for all purposes.

The present disclosure relates to high speed signal communications implemented in a printed circuit board for electronic devices.

High speed digital communications, error correction techniques, coding methods, and the copper medium they travel through has finally reached a limit. In particular, at speeds up to 112 Gbps, it may be difficult for such high speed signals to effectively travel for run lengths more than 2 inches, making conventional copper based signal traces impractical and forcing the migration to fiber. It is desirable to provide enhanced copper based signal traces having sufficient conductivity to support high speed communication signals.