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Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

專利號
US12160948B2
公開日期
2024-12-03
申請人
Cisco Technology, Inc.(US CA San Jose)
發(fā)明人
Joel Goergen; Scott Hinaga; Jessica Kiefer; Alpesh Umakant Bhobe; D. Brice Achkir; David Nozadze; Amendra Koul; Mehmet Onder Cap; Madeline Marie Roemer
IPC分類
H05K1/02
技術(shù)領(lǐng)域
graphene,copper,conductive,pcb,trace,signal,structure,layer,embedded,depth
地域: CA CA San Jose

摘要

A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

說明書

FIG. 1A depicts a view in perspective of an embodiment of a layer or sheet of copper with graphene applied to a surface of the copper sheet.

FIG. 1B depicts a side view in cross-section of the embodiment of FIG. 1A.

FIG. 2 is a cross-sectional view of an example embodiment of a printed circuit board (PCB) including conductive signal trace structures disposed within the PCB and connecting with vias extending through portions of the PCB.

FIG. 3A depicts an enlarged view of a portion of the PCB of FIG. 2, including a conductive signal trace structure connecting a pair of vias.

FIG. 3B depicts a cross-sectional view of the conductive signal trace structure of FIG. 3A.

FIG. 4 depicts a cross-sectional view of an alternative embodiment of a conductive signal trace structure.

FIG. 5 depicts a cross-sectional view of another alternative embodiment of a conductive signal trace structure.

FIGS. 6A and 6B depict cross-sectional views of example embodiments a conductive signal wire structure.

FIG. 7 depicts an example embodiment of a PCB including a component connected with the PCB via the conductive signal wire structure of FIG. 6A or 6B.

權(quán)利要求

1
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