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Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

專利號(hào)
US12160948B2
公開日期
2024-12-03
申請(qǐng)人
Cisco Technology, Inc.（US CA San Jose）
發(fā)明人
Joel Goergen; Scott Hinaga; Jessica Kiefer; Alpesh Umakant Bhobe; D. Brice Achkir; David Nozadze; Amendra Koul; Mehmet Onder Cap; Madeline Marie Roemer
IPC分類
H05K1/02
技術(shù)領(lǐng)域
graphene,copper,conductive,pcb,trace,signal,structure,layer,embedded,depth
地域： CA CA San Jose

摘要

A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

說明書

) ? R 3 R 4 + j ? ω ? L 3 + R 3 + j ? ω ? L 2 + R 2 + j ? ω ? L 1 ) ? R 1 ( ( R 4 + j ? ω ? L 3

權(quán)利要求

1
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