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Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

專利號(hào)
US12160948B2
公開(kāi)日期
2024-12-03
申請(qǐng)人
Cisco Technology, Inc.(US CA San Jose)
發(fā)明人
Joel Goergen; Scott Hinaga; Jessica Kiefer; Alpesh Umakant Bhobe; D. Brice Achkir; David Nozadze; Amendra Koul; Mehmet Onder Cap; Madeline Marie Roemer
IPC分類
H05K1/02
技術(shù)領(lǐng)域
graphene,copper,conductive,pcb,trace,signal,structure,layer,embedded,depth
地域: CA CA San Jose

摘要

A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

說(shuō)明書(shū)

FIG. 8 is a flowchart describing process steps associated with forming a conductive signal structure as described herein.

FIG. 9 depicts a DC unit circuit model for determination of DC resistance and conductance across a graphene embedded copper trace.

FIG. 10 depicts an AC transmission line model for determination of a frequency dependent resistance across a graphene embedded coper trace.

FIG. 11A depicts a cross-sectional view of the conductive signal trace structure of FIG. 4 and further including concentric shapes within the cross-section that correspond with ladder sections for a R-L ladder circuit model shown in FIG. 11B.

FIG. 11B depicts a R-L ladder circuit model for the conductive trace of FIG. 11A.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Overview

A conductive signal transmission structure is provided or transmission of signals for an electronic device that comprises a copper material and a graphene layer disposed within the copper material at a depth below a surface of the conductive signal transmission structure.

權(quán)利要求

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