Heat removal architecture for stack-type component carrier with embedded component
地域：
Leoben
摘要
A component carrier including a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component embedded in the stack, and a heat removal body configured for removing heat from the component is connected to the stack and preferably to the component. The heat removal body including a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component.
說明書
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The present application claims priority to European Patent Application No. 21156188.1 filed Feb. 10, 2021, the disclosure of which is incorporated herein by reference.
The disclosure relates to a method of manufacturing a component carrier, and to a component carrier.
In the context of growing product functionalities of component carriers equipped with one or more electronic components and increasing miniaturization of such components as well as a rising number of components to be connected to the component carriers such as printed circuit boards, increasingly more powerful array-like components or packages having several components are being employed, which have a plurality of contacts or connections, with ever smaller spacing between these contacts. In particular, component carriers shall be mechanically robust and electrically reliable so as to be operable even under harsh conditions.
For sophisticated electronic tasks, one or multiple components (such as silicon dies) can be embedded in a laminated layer stack of a component carrier (such as a printed circuit board). During operation of the component carrier, the at least one embedded component may generate a considerable amount of heat, for instance due to ohmic losses. However, the heat dissipation of the one or more embedded components is then becoming a real hurdle. In conventional approaches, heat dissipation or management may be inappropriate which introduces shortcomings during operation. By excessive heating during operation, the performance and the reliability of the component carrier may be deteriorated.
權利要求
The invention claimed is:1. A component carrier, comprising:a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack; and a heat removal body configured for removing heat from the component and being connected to the stack and to the component, wherein the heat removal body is in direct contact with the component, the heat removal body comprising: a component-sided first heat removal structure thermally coupled with the component; and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component, wherein the second heat removal structure comprises a dielectric thermal interface material at a top side and/or at a bottom side, wherein the second heat removal structure comprises a phase change material, the dielectric thermal interface material directly contacting the phase change material. 2. The component carrier according to claim 1 , wherein the first heat removal structure is a continuous thermally conductive sheet or comprises a plurality of thermally conductive pads. 3. The component carrier according to claim 1 , comprising at least one of the following features:wherein the first heat removal structure comprises at least one of the group consisting of a metal, and a ceramic; wherein the second heat removal structure comprises a patterned thermally conductive sheet comprising multiple through holes, wherein the through holes are at least partially filled with at least one of the group consisting of a thermally conductive filling medium, and the phase change material. 4. The component carrier according to claim 1 , wherein the second heat removal structure comprises at least one of the group consisting of a metal, and a ceramic. 5. The component carrier according to claim 1 , wherein the heat removal body comprises a patterned adhesive sheet adhesively bonding and thermally coupling the first heat removal structure with the second heat removal structure. 6. The component carrier according to claim 5 , comprising at least one of the following features:wherein through holes of the patterned adhesive sheet are at least partially filled with at least one of the group consisting of a thermally conductive filling medium, and the phase change material; wherein the patterned adhesive sheet is electrically insulating and thermally conductive; wherein the patterned adhesive sheet is a contiguous structure with the plurality of through holes, wherein a ratio between a partial area of the through holes and a remaining partial area of the adhesive material of the patterned adhesive sheet is at least 20%, and not more than 80%. 7. The component carrier according to claim 1 , wherein the second heat removal structure is located at or directly next to an exterior main surface of the component carrier. 8. The component carrier of claim 1 ,wherein the component is embedded entirely within the stack, and wherein adjacent surfaces of the stack and the heat removal body are respective planar surfaces. 9. The component carrier of claim 1 ,wherein the second heat removal structure of the heat removal body is bounded by an insulating layer along a surface opposed to the embedded component and the first heat removal structure. 10. The component carrier of claim 1 ,wherein the second heat removal structure of the heat removal body is bounded laterally by an adhesive removed from the first heat removal structure. 11. A method of manufacturing a component carrier, wherein the method comprises:embedding a component in a stack which comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and connecting a heat removal body to the stack and to the component, the heat removal body being configured for removing heat from the component, wherein the heat removal body is in direct contact with the component, the heat removal body comprising: a component-sided first heat removal structure thermally coupled with the component; and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component, wherein the second heat removal structure comprises a dielectric thermal interface material at a top side and/or at a bottom side, wherein the second heat removal structure comprises a phase change material, the dielectric thermal interface material directly contacting the phase change material. 12. The method according to claim 11 , wherein the method comprises:preforming at least part of the heat removal body; and thereafter connecting the preformed at least part of the heat removal body with the stack. 13. The method according to claim 11 , wherein the method comprises:providing the heat removal body with a patterned adhesive sheet adhesively bonding and thermally coupling the first heat removal structure with the second heat removal structure. 14. The method according to claim 13 , wherein the method comprises:preforming at least part of the second heat removal structure by forming multiple through holes in a thermally conductive sheet; and thereafter connecting the preformed at least part of the second heat removal structure with the first heat removal structure, being already connected with the stack and the component, by the adhesive sheet. 15. The method according to claim 14 , comprising at least one of the following features:wherein the method comprises preforming at least part of the second heat removal structure by inserting an inlay in a through hole of a base sheet and thereafter patterning the inlay; wherein the method comprises connecting at least part of the second heat removal structure with the first heat removal structure by pressing the adhesive sheet between the at least part of the second heat removal structure and the first heat removal structure; wherein the method comprises patterning the adhesive sheet after connecting the preformed at least part of the second heat removal structure with the first heat removal structure. 16. The method according to claim 13 , wherein the method comprises:patterning the adhesive sheet so that through holes of the patterned adhesive sheet are in alignment with through holes of the second heat removal structure. 17. The method according to claim 13 , wherein the method comprises:patterning the adhesive sheet by at least one of the group consisting of laser processing, mechanically drilling, etching, photo irradiating a photoimageable dielectric, and locally applying a glue. 18. The method according to claim 13 , wherein the method comprises:at least partially filling through holes of a preform of the second heat removal structure and/or through holes of the patterned adhesive sheet with at least one of the group consisting of a thermally conductive filling medium, and the phase change material.
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