In an embodiment, the first heat removal structure is a continuous thermally conductive sheet. For instance, such a continuous thermally conductive sheet may be planar and free of through holes. A continuous thermally conductive sheet may ensure a two-dimensional heat removal performance over an entire area of the component, as well as a heat spreading and distribution laterally beyond the component. For example, the continuous thermally conductive sheet may be a sufficiently thick copper foil which may be simply laminated on the layer stack with embedded component. It is however also possible that one or more through holes are formed in the thermally conductive sheet which may nevertheless remain continuous, i.e., one common structure rather than separate islands.

Alternatively, the first heat removal structure comprises a plurality of separate thermally conductive pads arranged in a coplanar way. Hence, it is also possible that the first heat removal structure is composed of a number of island-type separate pads in a common plane which may be provided specifically at regions for guiding out heat from the component to an exterior surface of the component carrier. The configuration of the first heat removal structure as separate thermally conductive pads or islands may allow to precisely define heat removal paths in the component carrier to obtain a directed and accurately definable heat removal performance.

In an embodiment, the first heat removal structure comprises a metal (in particular copper) and/or a ceramic. Thus, the first heat removal structure may be thermally conductive, and electrically conductive or insulating.