The present application claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. 2021-112668 filed on Jul. 7, 2021, the entire contents of which are hereby incorporated herein by reference.

The present disclosure relates to a cooling apparatus and a cooling system.

A known cooling apparatus of a liquid-cooling type includes: a circulatory path for a coolant that cools a temperature rise portion; a heat absorbing unit that absorbs heat from the temperature rise portion by the coolant; a heat radiating unit that radiates the heat from the coolant; and a pump that circulates the coolant.

In the known cooling apparatus, the heat absorbing unit is grounded to prevent a grounded liquid-contacting metal portion from being charged by, for example, static electricity.

In the known cooling apparatus, however, it is unclear how to connect the heat absorbing unit to the ground. In mounting the cooling apparatus to an actual machine, the routing of a ground lead becomes problematic.

A cooling apparatus according to an example embodiment of the present disclosure includes a cold plate made of a metal and being in contact with a heat generating component, a casing including an internal space defined therein and including a flow path along which a refrigerant flows, the flow path being located in the internal space, a conductive component, and a connection connecting a first end of the conductive component to the cold plate. The conductive component includes a second end connected to a ground.