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Display panel and manufacturing method thereof, alignment method

專利號
US12178085B2
公開日期
2024-12-24
申請人
Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.(CN Beijing CN Sichuan)
發(fā)明人
Bo Cheng; Xiangdan Dong; Jun Yan; Fan He; Qi Liu; Hongwei Ma
IPC分類
H10K59/122; H10K50/844; H10K59/12; H10K71/00; H10K77/10
技術(shù)領(lǐng)域
layer,alignment,substrate,dam,marks,plate,cover,region,display,epl2
地域: Chengdu

摘要

A display panel includes a display substrate and a cover plate connected through an optical adhesive layer. The display substrate includes a plurality of light emitting elements, a pixel defining layer, and an encapsulation layer; the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer; the display panel includes a display region and a frame region including a cutting region and a dam glue region where a dam glue is located; at least one of a plurality of cover plate alignment marks is between the dam glue and the display region and is overlapped with the second inorganic encapsulation layer, and at least one of the plurality of cover plate alignment marks is between the dam glue and the cutting region.

說明書

For example, as illustrated in FIG. 1A and FIG. 2A, in the display panel provided by at least one embodiment of the present disclosure, the frame region includes a first frame region and a second frame region which are opposite in the first direction x, and a third frame region and a fourth frame region which are opposite in the second direction y. The display panel further includes a flexible circuit board 40 connected with the second frame region, and the flexible circuit board 40 is electrically connected with signal lines in the display region to achieve signal transmission. For example, as illustrated in FIG. 1H, a lead line 70 (the number of the lead line 70 may be one or more; the lead line 70 is not overlapped with the cover plate alignment marks 142, 143, for example) is electrically connected with the second electrode layer 122 of the light emitting element 12 (not shown in FIG. 1H), so that an electrical signal is applied to the second electrode layer 122 through the lead line 70.

It should be noted that FIG. 1A shows a schematic diagram of the flexible circuit board 40 in an unfolded state; after the product is assembled, a portion of the flexible circuit board 40 located in a bent region of the circuit board is bent to bend the flexible circuit board 40 to a back side of the display panel. In addition, the embodiment shown in FIG. 1A is described only by taking the case where the planar shape of the display panel is a rectangle as an example; in other embodiments, the planar shape of the display panel can be diamond, circle, and other needed shapes.

權(quán)利要求

1
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