In other embodiments, at least one of the plurality of cover plate alignment marks 14 located between the dam glue 50 and the cutting region is at least partially overlapped with the second inorganic encapsulation layer EPL2 in the direction perpendicular to the base substrate 11. For example, in at least another embodiment, the second inorganic encapsulation layer EPL2 in the encapsulation layer EPL exceeds the dam glue 50, and as illustrated in FIG. 1F, the cover plate alignment mark 14 (for example, at least one of the cover plate alignment marks 142 and 143 in FIG. 1A) located in the second frame region and between the dam glue 50 and the cutting region is overlapped with the second inorganic encapsulation layer EPL2 and is located on a side of the second inorganic encapsulation layer EPL2 away from the base substrate 11. Or, in at least another embodiment, the second inorganic encapsulation layer EPL2 in the encapsulation layer EPL exceeds the dam glue 50, and the cover alignment mark 14 (for example, at least one of the cover alignment marks 142 and 143 in FIG. 1A) located in the second frame region and between the dam glue 50 and the cutting region is overlapped with the pixel defining layer PDL and the second inorganic encapsulation layer EPL2 and is located on a side of the second inorganic encapsulation layer EPL2 away from the base substrate 11.
