For example, as illustrated in FIG. 1B, the display substrate 10 includes a touch structure 15, which is located between the encapsulation layer EPL and the optical adhesive layer 20 in the direction perpendicular to the base substrate 11. In this case, for example, the display panel can be manufactured by sequentially manufacturing the buffer layer BF, the switching element 19, the first planarization insulating layer PLN1, the second planarization insulating layer PLN2, the light emitting element 12, and the encapsulation layer EPL on the base substrate 11, then manufacturing the touch structure 15 on the base substrate 11 formed with the encapsulation layer EPL, and then adhering the display substrate 10 formed with the touch structure 15 and the cover plate 30 together through the optical adhesive layer 20. Compared with the method of manufacturing touch structure on the cover plate and then adhering the cover plate formed with the touch structure to the display substrate, the embodiments of the present disclosure can greatly reduce the costs by forming the touch structure 15 in the display substrate 10, and can make the display panel more integrated and thinner, and easier to be folded.
