For example, the touch structure 15 includes at least one metal layer, and the at least one metal layer includes the cover plate alignment marks 14. The manufacturing process can be simplified by locating the cover plate alignment marks 14 in the metal layer included in the touch structure 15. In addition, because the touch structure 15 is located between the encapsulation layer EPL and the optical adhesive layer 20, the metal layer included in the touch structure 15 includes the cover plate alignment marks 14, so that it is not needed to increase the size of the frame region, which is beneficial to achieve the narrow frame design. Similarly, in order to further simplify the manufacturing process, other alignment marks included in the display substrate 10 (for example, the circuit board alignment mark 41) can also be manufactured by using the original metal layer of the display substrate. For example, because other alignment marks (such as the circuit board alignment mark 41) included in the display substrate 10 are small in size, the alignment marks can be made of the forming material of the metal layer included in the switching element 19 or the light emitting element 12 without increasing the space of the frame region. It should be noted that the orthographic projections of the plurality of cover plate alignment marks 14 on the base substrate 11 are spaced apart from the orthographic projections of other alignment marks on the base substrate 11, so as to prevent other alignment marks from affecting the alignment between the display substrate 10 and the cover plate 30.