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Display panel and manufacturing method thereof, alignment method

專利號
US12178085B2
公開日期
2024-12-24
申請人
Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.(CN Beijing CN Sichuan)
發(fā)明人
Bo Cheng; Xiangdan Dong; Jun Yan; Fan He; Qi Liu; Hongwei Ma
IPC分類
H10K59/122; H10K50/844; H10K59/12; H10K71/00; H10K77/10
技術(shù)領(lǐng)域
layer,alignment,substrate,dam,marks,plate,cover,region,display,epl2
地域: Chengdu

摘要

A display panel includes a display substrate and a cover plate connected through an optical adhesive layer. The display substrate includes a plurality of light emitting elements, a pixel defining layer, and an encapsulation layer; the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer; the display panel includes a display region and a frame region including a cutting region and a dam glue region where a dam glue is located; at least one of a plurality of cover plate alignment marks is between the dam glue and the display region and is overlapped with the second inorganic encapsulation layer, and at least one of the plurality of cover plate alignment marks is between the dam glue and the cutting region.

說明書

For example, the touch structure 15 includes at least one metal layer, and the at least one metal layer includes the cover plate alignment marks 14. The manufacturing process can be simplified by locating the cover plate alignment marks 14 in the metal layer included in the touch structure 15. In addition, because the touch structure 15 is located between the encapsulation layer EPL and the optical adhesive layer 20, the metal layer included in the touch structure 15 includes the cover plate alignment marks 14, so that it is not needed to increase the size of the frame region, which is beneficial to achieve the narrow frame design. Similarly, in order to further simplify the manufacturing process, other alignment marks included in the display substrate 10 (for example, the circuit board alignment mark 41) can also be manufactured by using the original metal layer of the display substrate. For example, because other alignment marks (such as the circuit board alignment mark 41) included in the display substrate 10 are small in size, the alignment marks can be made of the forming material of the metal layer included in the switching element 19 or the light emitting element 12 without increasing the space of the frame region. It should be noted that the orthographic projections of the plurality of cover plate alignment marks 14 on the base substrate 11 are spaced apart from the orthographic projections of other alignment marks on the base substrate 11, so as to prevent other alignment marks from affecting the alignment between the display substrate 10 and the cover plate 30.

權(quán)利要求

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