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Display panel and manufacturing method thereof, alignment method

專利號
US12178085B2
公開日期
2024-12-24
申請人
Chengdu BOE Optoelectronics Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.(CN Beijing CN Sichuan)
發(fā)明人
Bo Cheng; Xiangdan Dong; Jun Yan; Fan He; Qi Liu; Hongwei Ma
IPC分類
H10K59/122; H10K50/844; H10K59/12; H10K71/00; H10K77/10
技術(shù)領(lǐng)域
layer,alignment,substrate,dam,marks,plate,cover,region,display,epl2
地域: Chengdu

摘要

A display panel includes a display substrate and a cover plate connected through an optical adhesive layer. The display substrate includes a plurality of light emitting elements, a pixel defining layer, and an encapsulation layer; the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer; the display panel includes a display region and a frame region including a cutting region and a dam glue region where a dam glue is located; at least one of a plurality of cover plate alignment marks is between the dam glue and the display region and is overlapped with the second inorganic encapsulation layer, and at least one of the plurality of cover plate alignment marks is between the dam glue and the cutting region.

說明書

For example, as illustrated in FIG. 2B, the first conductive layer 171 extends to a side of the second dam glue 52 away from the first dam glue 51, the first sub-conductive layer 172A and the second sub-conductive layer 172B both extend to a region where the second dam glue 52 is arranged in the display substrate 10, and the third sub-conductive layer 172C extends to a side of the first dam glue 51 away from the second dam glue 52. In this case, for example, the lead line 70 (as illustrated in FIG. 1H) led out from the flexible circuit board 40 is in direct contact with the first conductive layer 171, so that the lead line 70 is electrically connected to the second electrode layer 122 of the light emitting element 12 through the electrode layer extending portion 17. In other embodiments, the lead line 70 may also directly contact the first sub-conductive layer 172A and/or the second sub-conductive layer 172B, so that the lead line 70 is electrically connected to the second electrode layer 122 of the light emitting element 12 through the electrode layer extending portion 17.

權(quán)利要求

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