In this comparative example, when the analysis EL layer 94T is treated with the sputter gun 42 and the primary ion gun 43, charges are accumulated on the surface of the analysis EL layer 94T. The amount of the charges to be accumulated on the surface of the analysis EL layer 94T increases as the sputtering time proceeds. Hence, a problem of the comparative example is that, as the sputtering time proceeds, a profile of an intensity signal according to the mass-separation is disturbed. Consequently, output of the intensity signal stops.

In this embodiment, when the analysis EL layer 24T is treated with the sputter gun 42 and the primary ion gun 43, charges accumulated on the surface of the analysis EL layer 24T can be dissipated through the second metal film 25T, the first metal film 221, and the ground wire GW. Such a feature can reduce the risk that the charges are accumulated on the surface of the analysis EL layer 241 during the analysis. Hence, the feature can solve the problems of (i) the charges accumulated in a shorter period of time when an analysis element (an analysis layer) is downsized as a display element is downsized, and (ii) the resulting difficulty in appropriate inspection for deterioration. As a result, the feature makes it possible to appropriately and readily conduct an inspection for deterioration even if the display device is downsized.