(1-2. Method of Manufacturing Imaging Element)
It is possible to manufacture the imaging element 10A according to the present embodiment as follows, for example.
FIGS. 6 to 10 illustrate a method of manufacturing the imaging element 10A in process order. First, as illustrated in FIG. 6, for example, the p-well 31 is formed as a well of a first conductivity type in the semiconductor substrate 30, and the inorganic photoelectric converters 32G and 32R of a second conductivity type (for example, an n type) are formed in this p-well 31. A p+ region is formed in proximity to the first surface (the surface 30S1) of the semiconductor substrate 30.