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Method for manufacturing a semiconductor storage device including a division film

專利號
US12185539B2
公開日期
2024-12-31
申請人
Kioxia Corporation(JP Tokyo)
發(fā)明人
Kazuharu Yamabe; Yoshiro Shimojo
IPC分類
H10B43/27
技術領域
columnar,film,insulating,sgdo,cl2a,cl2b,body,stacked,conductive,bodies
地域: Tokyo

摘要

In a method for manufacturing a memory, a first stacked body is formed by stacking a first insulating film and a first sacrificial film. A first columnar body including a first semiconductor portion extending in the first stacked body in the first direction and a charge trapping film provided on an outer peripheral surface of the first semiconductor portion is formed. A second columnar body provided in a second direction of the first columnar body and including a second semiconductor portion stretching in the first stacked body in the first direction and a charge trapping film on an outer peripheral surface of the second semiconductor portion is formed. A second insulating film is formed above the first stacked body. A third columnar body including a third semiconductor portion provided on both the first columnar body and the second columnar body and stretching in the second insulating film in the first direction and a first gate insulating film provided on an outer peripheral surface of the third semiconductor portion is formed. A first division insulating film extending in the first direction and a third direction intersecting the first direction and the second direction and dividing the third semiconductor portion of the third columnar body in the second direction is formed.

說明書

As illustrated in FIG. 1B, in a plan view seen from the Z direction, the first stacked body 1, the second stacked body 2, and the third stacked body 3 include a staircase portion 2s and a memory cell array 2m. In the staircase portion 2s, the memory cell array 2m is interposed between or surrounded by the staircase portion 2s. The slit ST is provided from the staircase portion 2s at one end of the stacked bodies 1 to 3 to the staircase portion 2s at the other end of the stacked body over the memory cell array 2m. The portion of the stacked bodies 1 to 3 interposed between the slits ST is called a block BLOCK. The block configures, for example, the smallest unit of data erasure. As described above, the block BLOCK is further partitioned in finer units by the first division insulating film 50. The on/off state of the drain-side select gate SGDO can be controlled in units (fingers) partitioned by the first division insulating film 50. The finger is a unit at the time of writing and reading data. By selecting the drain-side select gate SGDO corresponding to one finger in the block, the data of the memory cell corresponding to the finger can be read or written at a time. The layout of the memory cell array 2m and the staircase portion 2s is not limited thereto, and any layout may be designed.

權利要求

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