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Method for manufacturing a semiconductor storage device including a division film

專(zhuān)利號(hào)
US12185539B2
公開(kāi)日期
2024-12-31
申請(qǐng)人
Kioxia Corporation(JP Tokyo)
發(fā)明人
Kazuharu Yamabe; Yoshiro Shimojo
IPC分類(lèi)
H10B43/27
技術(shù)領(lǐng)域
columnar,film,insulating,sgdo,cl2a,cl2b,body,stacked,conductive,bodies
地域: Tokyo

摘要

In a method for manufacturing a memory, a first stacked body is formed by stacking a first insulating film and a first sacrificial film. A first columnar body including a first semiconductor portion extending in the first stacked body in the first direction and a charge trapping film provided on an outer peripheral surface of the first semiconductor portion is formed. A second columnar body provided in a second direction of the first columnar body and including a second semiconductor portion stretching in the first stacked body in the first direction and a charge trapping film on an outer peripheral surface of the second semiconductor portion is formed. A second insulating film is formed above the first stacked body. A third columnar body including a third semiconductor portion provided on both the first columnar body and the second columnar body and stretching in the second insulating film in the first direction and a first gate insulating film provided on an outer peripheral surface of the third semiconductor portion is formed. A first division insulating film extending in the first direction and a third direction intersecting the first direction and the second direction and dividing the third semiconductor portion of the third columnar body in the second direction is formed.

說(shuō)明書(shū)

Similarly, the four columnar bodies CL2 in the upper stage corresponding to the second conductive films 22_3 and 22_4 can simultaneously output data to the bit lines BL1, BL4, BL2, and BL3, respectively. Similarly, the four columnar bodies CL2 in the upper stage corresponding to the second conductive films 22_5, 22_6, and 22_0 can simultaneously output data to the bit lines BL1, BL4, BL2, and BL3, respectively. The second conductive films 22_1 and 22_2, the second conductive films 22_3 and 22_4, and the second conductive films 22_5, 22_5, and 22_0 are driven at timings different from each other. Since the second conductive films 22_5 and 22_0 are conductive films at the end of the block BLOCK, the second conductive films 22_5 and 22_0 correspond to one columnar body CL2 in the upper stage, respectively.

Similarly, the active areas Aa arranged in the Y direction in the second and subsequent stages also correspond to four bit lines BL, respectively. Therefore, the data from the drain-side select transistors configured with the columnar bodies arranged in the second and subsequent stages can also be read out without contamination via different bit lines BL.

A ratio between the number of columnar bodies CL2 and the number of bit lines BL may be 1:n (n is an integer of 3 or more). Here, a ratio between the number of active areas Aa and the number of bit lines BL is 1:2×n. The number of the second conductive films 22 connected to each other (driven simultaneously) is also n, and thus, the number of data read simultaneously can be further increased.

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