The HTL 12 can be formed by, for example, an application method (method of dissolving the organic hole transport material described above in a solvent, and spin coating and then drying the solvent) or a dip coating method.
Note that, in the present embodiment as well, from the perspective of the versatility of a manufacturing apparatus, desirably the manufacturing apparatuses of each layer in the light-emitting element 10 are separated from each other. Accordingly, desirably the manufacturing apparatus of the HIL 11 and the film formation apparatus used in the next process (that is, manufacturing apparatus of the layer formed on the HIL 11) are separated from each other. Nevertheless, when the HIL 11 is formed and subsequently the substrate on which the HIL 11 is formed is transported to the manufacturing apparatus separated from the manufacturing apparatus of the HIL 11, the substrate on which the HIL 11 is formed is exposed to the atmosphere between the two manufacturing apparatuses.