FIG. 6 illustrates a method 100 for forming the device 200, or portions thereof, in accordance with some embodiments of the present disclosure. The methods 100 is discussed in reference to FIGS. 7A-20B, where FIGS. 7A, 8A, 9A, 10A, 11A, 12A, 13A, 14A, 15A, 16A, 17A, 18A, 19A, and 20A are cross-sectional views of FIG. 4 taken along line A-A′, and FIGS. 7B, 8B, 9B, 10B, 11B, 12B, 13B, 14B, 15B, 16B, 17B, 18B, 19B, and 20B are cross-sectional views of FIG. 4 taken along line B-B′, all at intermediate steps of the methods 100. It is noted that method 100 is merely an example and are not intended to limit the present disclosure beyond what is explicitly recited in the claims. Additional operations can be performed before, during, and after the method 100, and some operations described can be replaced, eliminated, or moved around for additional embodiments of the methods.
