The first encapsulation layer TFE1 may be disposed on the second electrode CE to hermetically seal or encapsulate the emission element OLED. The first encapsulation layer TFE1 may include at least one inorganic layer. For example, the first encapsulation layer TFE1 may include a multi-layered structure, in which inorganic and organic layers are repeatedly stacked. In the present embodiment, the first encapsulation layer TFE1 may include a first encapsulation inorganic layer IOL1, an encapsulation organic layer OL, and a second encapsulation inorganic layer IOL2. The first and second encapsulation inorganic layer IOL1/IOL2 may protect the emission element OLED from external moisture, and the encapsulation organic layer OL may prevent an imprinting failure from occurring in the emission element OLED due to an external contaminant during the fabrication process. The display panel DP may further include a refractive index control layer, which is configured to improve the upward emission efficiency of the first encapsulation layer TFE1.

As shown in FIG. 2A, the optical control layer OSL may be disposed on the first encapsulation layer TFE1. For example, the optical control layer OSL may be disposed on the second encapsulation inorganic layer IOL2. The optical control layer OSL may include the partition wall BW, a light control pattern CCF-R, a second encapsulation layer TFE2, a color filter CF-R, and a protection layer OC.

The partition wall BW may include a base resin having a highly transparent property and an additive agent. The base resin may be formed of various resin composites which may be called “binders”. The additive agent may include a coupling agent and/or a photo-initiator. The additive agent may further include a dispersing agent.