Dielectric barrier plasma generator and plasma discharge starting method for dielectric barrier plasma generator
地域：
Tokyo
摘要
A dielectric barrier plasma generator includes: a dielectric substrate, a high-voltage electrode provided on a first surface of the dielectric substrate, a low-voltage electrode provided to face a second surface of the dielectric substrate, a power introduction section provided at a first end of the high-voltage electrode, a gas channel formed from a first end to a second end thereof between the dielectric substrate and the low-voltage electrode to allow gas to flow from the first end of the gas channel to the second end thereof, and a blowout outlet formed at the second end of the gas channel to blow out the gas that has flown through the gas channel and plasma that has been generated in the gas channel. The dielectric substrate includes a portion having a thickness being thinner when being closer to the blowout outlet.
說(shuō)明書(shū)
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The present invention relates to a dielectric barrier plasma generator and a plasma discharge starting method for the dielectric barrier plasma generator.
Plasma generators find applications in manufacturing processes for plastics, paper, fibers, semiconductors, liquid crystals, films, and other materials. For example, irradiating these materials with plasma generated by plasma generators makes it possible to undergo surface treatment for improving hydrophilicity, adhesiveness, print adhesion, or the like on the surface to be irradiated, to remove organic matter from the surface to be irradiated and clean the surface thereof, and to form an oxide film on the surface to be irradiated.
權(quán)利要求
The invention claimed is:1. The dielectric barrier plasma generator comprising:a dielectric substrate having a first surface and a second surface; a high-voltage electrode having a proximal end and a distal end and located on the first surface of the dielectric substrate; a low-voltage electrode located to face the second surface of the dielectric substrate; a power introduction section located near one of the ends of the high-voltage electrode; a gas channel having a first end and a second end formed between the dielectric substrate and the low-voltage electrode in a direction from the first end to the second end to allow gas to flow from the first end of the gas channel to the second end while generating plasma thereof; a blowout outlet formed at the second end of the gas channel to blow out the gas that has flown through the gas channel and the plasma that has been generated in the gas channel, wherein a thickness between the first surface and the second surface of the dielectric substrate becomes thinner over a predetermined narrowing portion the dielectric substrate as approaching closer to the blowout outlet; and a clearance area located on the first surface of the dielectric substrate between the distal end of the high-voltage electrode and the blowout outlet for exposing the dielectric substrate. 2. The dielectric barrier plasma generator according to claim 1 , further comprising a power supply unit having an applied voltage of 3 kV to 20 kV and a frequency of 20 kHz to 150 kHz. 3. The dielectric barrier plasma generator according to claim 1 , wherein the gas channel includes a portion in which a gap between the dielectric substrate and the low-voltage electrode is narrower as being closer to the blowout outlet. 4. The dielectric barrier plasma generator according to claim 1 , further comprising a protective layer in a vicinity of the blowout outlet and on the low-voltage electrode so as to prevent a material constituting the low-voltage electrode from dispersing. 5. The dielectric barrier plasma generator according to claim 1 , wherein the dielectric substrate is made of a material including alumina or aluminum nitride. 6. The dielectric barrier plasma generator according to claim 1 , wherein the high-voltage electrode includes a foil metal. 7. The dielectric barrier plasma generator according to claim 6 , wherein the high-voltage electrode includes a sintered body containing conductive metal. 8. The dielectric barrier plasma generator according to claim 6 , wherein the high-voltage electrode is formed by plating, vapor deposition, or sputtering. 9. The dielectric barrier plasma generator according to claim 1 , further comprising an auxiliary starting member that is disposed in a vicinity of the blowout outlet and on the second surface of the dielectric substrate. 10. The dielectric barrier plasma generator according to claim 1 , further comprising at least two gas introduction paths through which gas is introduced into the gas channel. 11. The dielectric barrier plasma generator according to claim 1 , further comprising a light-shielding member at the blowout outlet. 12. The dielectric barrier plasma generator according to claim 1 , further comprising a gas buffer substrate having a cavity thereinside, the gas buffer substrate being stacked on a surface of the low-voltage electrode, the surface being opposite to a surface facing the dielectric substrate. 13. The dielectric barrier plasma generator according to claim 1 , wherein the portion of the dielectric substrate has the thickness being thinner when being closer to the blowout outlet and has a staircase shape. 14. The dielectric barrier plasma generator comprising:a dielectric substrate having a first surface and a second surface; a high-voltage electrode having a proximal end and a distal end and located on the first surface of the dielectric substrate; a low-voltage electrode located to face the second surface of the dielectric substrate; a power introduction section located near one of the ends of the high-voltage electrode; a gas channel having a first end and a second end formed between the dielectric substrate and the low-voltage electrode in a direction from the first end to the second end to allow gas to flow from the first end of the gas channel to the second end while generating plasma thereof; a blowout outlet formed at the second end of the gas channel to blow out the gas that has flown through the gas channel and the plasma that has been generated in the gas channel, wherein a thickness between the first surface and the second surface of the dielectric substrate over a becomes thinner predetermined narrowing portion of the dielectric substrate as approaching closer to the blowout outlet; and a power supply unit having an applied voltage of 3 kV to 20 kV and a frequency of 20 kHz to 150 kHz to the high-voltage electrode so as to cause a dielectric barrier discharge between the high-voltage electrode and the low-voltage electrode through the dielectric substrate. 15. A plasma discharge starting method for a dielectric barrier plasma generator, providing:a dielectric substrate having a first surface and a second surface; a high-voltage electrode having a proximal end and a distal end and located on the first surface of the dielectric substrate; a low-voltage electrode located to face the second surface of the dielectric substrate; a power introduction section located near one of the ends of the high-voltage electrode; a gas channel having a first end and a second end formed between the dielectric substrate and the low-voltage electrode in a direction from the first end to the second end to allow gas to flow from the first end of the gas channel to the second end while generating plasma thereof; a blowout outlet formed at the second end of the gas channel to blow out the gas that has flown through the gas channel and the plasma that has been generated in the gas channel, wherein a thickness between the first surface and the second surface of the dielectric substrate becomes thinner over a predetermined narrowing portion of the dielectric substrate as approaching closer to the blowout outlet; and a clearance area located on the first surface of the dielectric substrate between the distal end of the high-voltage electrode, the plasma discharge starting method further comprising: a process A of introducing at least one type of starting gas selected from the group consisting of He, Ne, and Ar into the gas channel to generate plasma at a time of starting; a process B of introducing a gas for generating plasma into the gas channel after the process A; and a process C of preventing direct discharge between the high-voltage electrode and the low-voltage electrode while enabling the discharge between the high-voltage electrode and the low-voltage electrode through the dielectric substrate, thereby preventing damage to the high-voltage electrode, dielectric substrate, and low-voltage electrode.
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