Also, the window 340 and the second upper adhesive layer 350 may be attached to the impact absorbing layer 370 through a lamination process. Each of the window 340 and the second upper adhesive layer 350 may has a planar area less than that of the impact absorbing layer 370 in consideration of a process tolerance of the lamination process. Also, the second upper adhesive layer 350 may have a planar area less than that of the window 340. In an embodiment, for example, a pressure may be applied to the second upper adhesive layer 350 in a process of attaching the window 340. The second upper adhesive layer 350 may receive the pressure and be stretched in a direction parallel to the first direction DR1 and the second direction DR2. Here, the second upper adhesive layer 350 may have a planar area less than that of the window 340 so that the second upper adhesive layer 350 does not stretch further than the window 340 by pressure applied to the second upper adhesive layer 350.

When the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached, the window 340 may not be slipped during folding of the electronic device 1000 to generate a buckling phenomenon in the window 340. However, according to one or more embodiment, the second upper adhesive layer 350 has a planar area less than a planar area of the window 340. Thus, the first upper adhesive layer 330 may not be undesirably attached to the second upper adhesive layer 350 during attachment of the first upper adhesive layer 330 to the second upper adhesive layer 350, and a probability in which foreign substances are attached to the second upper adhesive layer 350 may decrease.