Electronic device
摘要
說明書
In an embodiment, the adhesive layer may have a thickness of about 10 μm or more and about 25 μm or less.
In an embodiment, the polyimide film may have a yield point at a strain of about 1.5% or more.
In an embodiment, at least one of the polyimide film and the adhesive layer may further include an anti-static agent.
In an embodiment, the polyimide film may have a haze of about 5% or less.
In an embodiment, an electronic device includes a display panel, a protection film which faces the display panel, and an adhesive layer which attaches the display panel to the protection film. The protection film includes a first anti-static layer directly attached to the adhesive layer and including a first binder including urethane and a first anti-static material, and a base film facing the adhesive layer with the first anti-static layer therebetween and including BPDA.
In an embodiment, the base film may further include a filler having a size of about 0.5 μm or more and about 2 μm or less.
In an embodiment, the protection film may further include a second anti-static layer spaced apart from the first anti-static layer with the base film therebetween, and the second anti-static layer may include a urethane-based binder and an anti-static agent.
In an embodiment, a first surface of the first anti-static layer which is directly attached to the adhesive layer, may have a polar surface energy of about 12 mN/m or more.
In an embodiment, a first surface of the first anti-static layer which is directly attached to the adhesive layer, may have a surface resistance of about 106Ω/□ or less.
