Electronic device
摘要
說明書
The first lower member 600 may be disposed below the cushion member 500. The first lower member 600 may include a plate 610, a lower adhesive layer 620 and a cover layer 630 in order from the cushion member 500. However, the above-described components contained in the first lower member 600 are not limited thereto. At least a portion of the above-described components may be omitted, and other components may be added.
The plate 610 may include a material having an elastic modulus of about 60 GPa or more at room temperature. In an embodiment, the plate 610 may include a material such as SUS304, but is not limited thereto. The plate 610 may support components disposed thereabove. Also, the electronic device 1000 may have an improved heat dissipation performance by the plate 610. The plate 610 and/or the first lower member 600 may define a heat dissipating layer.
An opening 611 may be defined in a portion of the plate 610. The opening 611 may be provided in plural including a plurality of openings. The opening 611 may be defined in an area of the plate 610 which overlaps or corresponds to the second area 1000A2. On a plane, e.g., when viewed in the third direction DR3, the opening 611 may overlap or be aligned with the second area 1000A2. The opening 611 may allow a portion of the plate 610 to be easily deformable.
