Electronic device
摘要
說明書
The cover layer 630 may be attached to the plate 610 by the lower adhesive layer 620. The lower adhesive layer 620 may include an adhesive material or sticking agent. The cover layer 630 may cover the opening 611 of the plate 610. Thus, the cover layer 630 may additionally reduce or effectively prevent foreign substances from being introduced to the opening 611 from outside thereof.
The cover layer 630 may include a material having an elastic modulus lower than that of the plate 610. In an embodiment, for example, the cover layer 630 may include a thermoplastic polyurethane. However, the invention is not limited thereto.
The plate 610 may have a thickness of about 120 μm to about 180 μm, e.g., about 150 μm. The lower adhesive layer 620 may have a thickness of about 4 μm to about 15 μm, e.g., about 8 μm. The cover layer 630 may have a thickness of about 4 μm to about 15 μm, e.g., about 8 μm. However, the thickness of the plate 610, the thickness of the lower adhesive layer 620 and the thickness of the cover layer 630 are not limited to the above-described values.
