Electronic device
摘要
說明書
The gap tape 724 may be attached to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 which are spaced apart from each other with the heat dissipation layer 721 therebetween. The gap tape 724 may be provided in plural within a same one of the second lower member 700. The gap tape 724 may include a plurality of layers. In an embodiment, for example, the gap tape 724 may include a substrate layer, a top adhesive layer disposed on a top surface of the substrate layer, and a bottom adhesive layer disposed on a bottom surface of the substrate layer.
The heat dissipation layer 721 may be attached to the lower plate 710 by the first heat dissipation adhesive layer 722. The heat dissipation layer 721 may be sealed by the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723 together with the gap tape 724. The heat dissipation layer 721 may be a graphitized polymer film. The polymer film may be, e.g., a polyimide film. Each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may have a thickness of about 3 μm to about 8 μm, e.g., about 5 μm. Each of the heat dissipation layer 721 and the gap tape 724 may have a thickness of about 10 μm to about 25 μm, e.g., about 17 μm. However, the thickness of each of the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723 and the gap tape 724 are not limited to the above-described values.
