Memory device and electronic device including the same
摘要
說(shuō)明書
The memory connector MCN may include a plurality of connection terminals EL1. The plurality of connection terminals EL1 may be arranged to be spaced apart along the second direction Y. Each connection terminal EL1 of the memory connector MCN may be connected to each connection terminal EL1 of the corresponding host connector 200. A detailed explanation of the connection between the memory connector MCN and the host connector 200 is provided below.
Each connection terminal EL1 of the memory connector MCN may be connected to the wiring of the module board BDH. When the memory connector MCN is provided integrally with the module board BDH, the connection terminal EL1 of the memory connector MCN may be formed on the same layer, using the same material as the wiring of the module board BDH. Each connection terminal EL1 may have a shape of a pad electrode having a width wider than the wiring of the module board BDH. The plurality of connection terminals EL1 may be exposed to the outside, while at least partially not being covered with the insulating layer. The plurality of connection terminals EL1 may be placed on the upper face UF of the memory connector MCN, and may be placed on the lower face BF. In some cases, the plurality of connection terminals EL1 may be placed on both the upper and bottom faces BF of the memory connector MCN. Furthermore, the memory connector MCN includes a plurality of layers separated in the thickness direction, and a plurality of connection terminals EL1 may be placed on at least one face of each layer.
